Concurrent upgrade and backup of non-volatile memory

ABSTRACT

An endurance parameter value of a non-volatile memory included in a non-volatile dual in-line memory module (NVDIMM) can be monitored and compared against a warning threshold value. In response to the endurance parameter exceeding the warning threshold value, a system alert can be generated, within a host system of the NVDIMM, to inform a system user that the NVDIMM is approaching its end-of-life. If the endurance parameter exceeds a replacement threshold value greater than the warning threshold value, an upgrade process can be initiated. The upgrade process can include copying data from the first non-volatile memory to a volatile memory of the NVDIMM and copying, in response to the first non-volatile memory being replaced with a second non-volatile memory, the data from the volatile memory to the second non-volatile memory.

BACKGROUND

The present disclosure generally relates to a hybridvolatile/non-volatile memory device. In particular, this disclosurerelates to replacing a non-volatile memory component of such a hybridmemory device.

Semiconductor memory devices or chips can be used in computers and otherelectronic systems to electronically store data. For example,instructions for a processor circuit and data processed by the processorcircuit can both be stored in semiconductor memory chips. Such memorychips may be fabricated using a variety of semiconductor technologies.The time to access all data locations within a semiconductor memory chipis generally uniform, which can result in efficient storage andretrieval of data from any data location within the chip. Semiconductormemory chips can be “volatile” or “non-volatile” with regards to dataretention during interruption of electrical power supplied to a chip. Avolatile memory chip can lose data when the power supplied to the chipis interrupted, and a non-volatile chip is designed to retain dataduring power supply interruptions.

SUMMARY

Embodiments may be directed towards a method. The method may includemonitoring an endurance parameter value of a first non-volatile memoryof a non-volatile dual in-line memory module (NVDIMM) and generating, inresponse to the endurance parameter value exceeding a warning threshold,a system alert. The method may also include initiating, in response tothe endurance parameter value exceeding a replacement threshold greaterthan the warning threshold, an upgrade process. The upgrade process mayinclude copying data from the first non-volatile memory to a volatilememory of the NVDIMM and copying, in response to the first non-volatilememory being replaced with a second non-volatile memory, the data fromthe volatile memory to the second non-volatile memory.

Embodiments may also be directed towards an NVDIMM. The NVDIMM mayinclude a first non-volatile memory card having at least onenon-volatile memory chip and a second non-volatile memory card having atleast one non-volatile memory chip. The NVDIMM may also include avolatile memory card having at least one volatile memory chip and anNVDIMM controller. The volatile memory card may be configured toelectrically couple the NVDIMM controller, through a first connector, toa host system. The volatile memory card may also have a second connectorconfigured to electrically couple the NVDIMM controller, individually,to the first non-volatile memory card and to the second non-volatilememory card. The NVDIMM controller may be configured to perform amethod. The method may include monitoring an endurance parameter valueof the first non-volatile memory card and issuing, in response to theendurance parameter value exceeding a warning threshold, a system alertto the host system. The method may also include copying, in response tothe endurance parameter value exceeding a replacement threshold greaterthan the warning threshold, data stored in the first non-volatile memorycard to the volatile memory card. The method may also include enabling avisual indicator that indicates the first non-volatile memory card to bereplaced with the second non-volatile memory card. The method may alsoinclude copying, following replacement of the first non-volatile memorycard with the second non-volatile memory card, data stored in thevolatile memory card to the second non-volatile memory card.

The above summary is not intended to describe each illustratedembodiment or every implementation of the present disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

The drawings included in the present application are incorporated into,and form part of, the specification. They illustrate embodiments of thepresent disclosure and, along with the description, serve to explain theprinciples of the disclosure. The drawings are only illustrative ofcertain embodiments and do not limit the disclosure.

FIG. 1 includes three consistent views depicting a non-volatile dualin-line memory module (NVDIMM) having an NVDIMM controller and areplaceable non-volatile memory card, according to embodimentsconsistent with the figures.

FIG. 2 is a block diagram depicting a computing system including anNVDIMM with a replaceable non-volatile memory card, according toembodiments consistent with the figures.

FIG. 3 is a flow diagram illustrating a method for backing up andreplacing a non-volatile memory card of an NVDIMM, according toembodiments.

While the disclosure is amenable to various modifications andalternative forms, specifics thereof have been shown by way of examplein the drawings and will be described in detail. It should beunderstood, however, that the intention is not to limit the disclosureto the particular embodiments described. On the contrary, the intentionis to cover all modifications, equivalents, and alternatives fallingwithin the spirit and scope of the invention.

In the drawings and the Detailed Description, like numbers generallyrefer to like components, parts, steps, and processes.

DETAILED DESCRIPTION

Certain embodiments of the present disclosure can be appreciated in thecontext of providing high-bandwidth, non-volatile data storage for usewith integrated circuits (ICs) such as processor chips, which may beused to provide computational capability for electronic systems such ascomputers and servers. Such computers and servers may include, but arenot limited to web servers, application servers, mail servers, andvirtual servers. While not necessarily limited thereto, embodimentsdiscussed in this context can facilitate an understanding of variousaspects of the disclosure. Certain embodiments may also be directedtowards other equipment and associated applications, such as providinghigh-bandwidth, non-volatile data storage for use with ICs such asspecial-purpose processors, which may be used in a wide variety ofcomputational and data processing applications. Such computing systemsmay include, but are not limited to, supercomputers, high-performancecomputing (HPC) systems, and other types of special-purpose computers.Embodiments may also be directed towards providing high-bandwidth,non-volatile data storage for use with processor ICs arranged instacked, high-density configurations, for example, in three-dimensionalintegrated circuit (3-D IC) structures.

For ease of discussion, the term “non-volatile memory” is usedinterchangeably herein with the term “flash memory”, in reference to aclass of semiconductor memory chips and/or memory cards populated withchips, which can provide long-term, persistent data storage forelectronic systems such as computers. Such memory chips are designed toretain data following the removal or interruption of power supplied tothe chip. For ease of discussion, the term “volatile memory” is usedinterchangeably herein with the term “dynamic random-access memory(DRAM)”, with reference to a class of semiconductor memory chips and/ormemory cards populated with chips, which can provide temporary, volatileelectronic data storage. Such memory chips do not retain data followingthe removal or interruption of power supplied to the chip.

A non-volatile dual in-line memory module (NVDIMM) incorporates, in ahybrid device, both volatile memory, e.g., DRAM, and non-volatilememory, e.g., flash memory. An NVDIMM also includes a memory controllerand an independent electrical power source known as a “supercapacitor”or “ultracapacitor”.

An NVDIMM can have a form factor and electrical interface compatiblewith an industry standard dual in-line memory module (DIMM) such as adouble data rate type three (DDR3) or a double data rate type four(DDR4) DIMM, that allow it to be used in computing systems designed forthese types of devices. The form factor can include the module outline,dimensions and edge card connector pinout, while the electricalinterface can include a signaling protocol that is compatible withindustry standard memory modules.

During normal operation, an NVDIMM is plugged into, and draws powerfrom, an industry standard DIMM socket and operates in a mannerconsistent with a standard DRAM DIMM, within a host electronic system.In the event of a power interruption such as an unexpected power loss orsystem crash, temporary power is provided by an independent power sourcesuch as a “supercapacitor”. The supercapacitor contains sufficientenergy capacity to power the NVDIMM controller to transfer the datastored in the volatile memory, e.g., DRAM, to the non-volatile memory,e.g., flash. When power is restored to the DIMM socket, the saved memorystate of the DRAM is restored to the DRAM from the NVDIMM's flash memoryby the NVDIMM controller. An NVDIMM can thus be useful for preservingand retaining critical data stored in it through a system crash or powerloss event.

An NVDIMM used in an electronic system such as a computer can providesignificant advantages over individual DRAM DIMMs and flash memory bycombining strengths of both of these memory technologies. An NVDIMM canmerge the high-bandwidth, low-latency performance of DRAM DIMMs with thehigh reliability and persistent storage of flash memory. An NVDIMM doesnot require host system interaction beyond normal read/write requests,and the non-volatile memory of an NVDIMM can store data for an extendedperiod without requiring a power supply voltage. In addition, therelative per-bit cost of non-volatile memory is generally lower than theper-bit cost of volatile memory, which can make NVDIMMs a cost-effectivealternative to other types of memory devices.

An NVDIMM can be useful for storing and ensuring the integrity ofcertain forms of critical data. For example, in applications such ashigh speed online transaction processing (OLTP), unexpected data losscould result in the failure of financial transactions, leaving dataunrecoverable or corrupted. If such data is stored in an NVDIMM, it canbe protected against corruption and loss due to unexpected andunpredictable events such as a system crash or unexpected power loss.

Various non-volatile memory technologies such as flash memory, aresubject to a physical “wear-out” mechanism which renders the memoryprogressively less reliable as the number of cycles of reading andwriting data, also known as “program-erase” (PE) cycles, increases. Anumber of PE cycles can serve as a criterion for quantifying theendurance of a flash memory device. Although manufacturers ofnon-volatile memory have taken various operations to extend the usablelifespan or “endurance limit” of non-volatile memory devices, eventuallysuch devices generally become unreliable and are replaced in order tomaintain the integrity of data stored in them. In contrast, volatilememory devices such as DRAM and static random-access memory (SRAM) chipslack such a wear-out mechanism, and therefore can have greatly extendedlifespans and seldom need to be replaced. As an NVDIMM includesnon-volatile memory devices, the non-volatile portion of the NVDIMM canbecome unreliable after a specified number of PE cycles, and may need tobe replaced in order to ensure the integrity of data stored in it.

An entire NVDIMM installed in a host system can be replaced at a regularservice interval in order to ensure its reliability and the integrity ofdata stored in it. However, this strategy may not be particularlycost-effective, as the volatile memory portion, printed circuit card andNVDIMM controller may still be serviceable and reliable. In addition,various NVDIMMs installed within a host system may accumulate PE cyclesat different rates, due to their unique usage patterns. ReplacingNVDIMMs at a regular service interval that is calculated and implementedfor the most active NVDIMM in a host system may result in other NVDIMMsbeing replaced unnecessarily early, thus increasing service costs andpossible system downtime during the replacement operation.

Replacing an entire NVDIMM while its host electronic system or computeris running may require either disabling or shutting down the hostsystem, or requiring the host system to move data stored in the NVDIMMto an alternate location for the duration of the replacement operation.Such operations may make the data stored in the NVDIMM inaccessiblewhile the NVDIMM is being replaced.

An NVDIMM according to embodiments of the present disclosure includes a“base” card of the NVDIMM populated with volatile memory chips, anNVDIMM controller and a connector configured to receive and electricallyconnect to a replaceable card populated with non-volatile memory chips.The NVDIMM controller is configured to monitor the number of PE cycles,or other endurance parameter, of the non-volatile memory chips andcompare the endurance parameter value to known endurance thresholdvalues. In response to at least one of the threshold values beingexceeded, the NVDIMM controller can alert a user or service technicianto initiate an upgrade process, during which the first, installednon-volatile memory card is replaced.

According to embodiments, this upgrade and replacement process allowsthe data stored in the installed non-volatile memory card to betemporarily transferred, by the NVDIMM controller, to the volatilememory card of the NVDIMM. During the upgrade process the data ispreserved and can still remain accessible to the host system, resultingin no system downtime or interruption to normal memory operations. Theinstalled non-volatile memory card of the NVDIMM is only replaced whenthe number of PE cycles exceeds a predetermined endurance thresholdvalue, resulting in cost-efficient use of memory cards and a reducednumber of service operations, while preserving the integrity of criticaldata stored in an NVDIMM.

Aspects of the various embodiments may be useful for providingcost-effective high-performance, non-volatile data storage for use withelectronic systems, by using existing and proven system design andsimulation practices, and memory device and printed circuit board (PCB)technologies. An NVDIMM designed according to certain embodiments may beuseful in reducing replacement costs and service actions related to thereplacement of non-volatile memory cards within an electronic system.

An upgrade process according to embodiments of the present disclosuremay provide for replacement of non-volatile memory cards that does notincur downtime of a host electronic system in which the modules areinstalled. Such an upgrade process may be performed without the need foradditional host system data storage and/or other host system resources,which may enhance host system availability and data integrity.

An upgrade process according to embodiments can effectively compensatefor the wear-out mechanism of a non-volatile memory card, and protectstored data by monitoring usage of the installed non-volatile memorycard and initiating its replacement prior to the device becomingunreliable. Embodiments of the present disclosure can incorporate avariety of flash and DRAM memory technologies.

The figures herein depict example memory cards and/or modules populatedwith a particular number of non-volatile and volatile memory chips. Inembodiments, the number of memory chips may vary, depending on factorssuch as memory architecture, organization and size, and whether thememory chips support parity and error-correcting code (ECC) schemes.

Certain embodiments relate to an NVDIMM configured to, during an upgradeprocess, back up data stored in an installed non-volatile memory card ofthe NVDIMM to a volatile memory card of the NVDIMM. FIG. 1 includesthree consistent views 100, 140 and 180, depicting an NVDIMM 101 thatincludes a replaceable non-volatile memory card 102 and a volatilememory card 112, according to embodiments of the present disclosure.NVDIMMs may be useful for providing an electrical system such as acomputer with high-bandwidth, low latency, persistent, non-volatile datastorage capability.

Volatile memory card 112 includes volatile memory chips 114, an NVDIMMmemory controller 116, memory card contact pads 122 and non-volatilememory card connector 108. Types of volatile memory chips 114 caninclude, but are not limited to, DRAM chips, random-access memory (RAM)chips and SRAM chips. Particular types and/or technologies of volatilememory chips may be chosen to meet the needs of a particularapplication. According to embodiments, volatile memory chips 114 can beuseful in providing high-bandwidth, low latency, random-accesselectronic data storage for a host electronic system such as a computer.

Non-volatile memory card connector 108 is mechanically configured toreceive and retain a replaceable non-volatile memory card 102, asdepicted in view 100. Memory card connector 108 is also configured toelectrically connect the NVDIMM controller 116 to the non-volatilememory card 102. Connector 108 can be selected or designed to providerobust electrical characteristics suitable for the transmission ofelectronic signals and delivery of electrical power to non-volatilememory card 102.

Non-volatile memory card connector 108 includes latches 110, which canbe used to secure non-volatile memory card 102 within memory cardconnector 108, when in a latched position, and to release non-volatilememory card 102 from memory card connector 108, when in a releasedposition, as shown in view 140.

Non-volatile memory card 102 includes non-volatile memory chips 104,which can be used to provide reliable, non-volatile data storage for ahost electronic system such as a computer. According to embodiments,types of non-volatile memory chips 104 can include, but are not limitedto, flash memory chips, erasable programmable read-only memory (EPROM)chips, ferroelectric random-access memory (FRAM) chips, magnetoresistiverandom-access memory (MRAM) chips, and other types of non-volatilesemiconductor memory devices. Particular types and/or technologies ofnon-volatile memory chips may be chosen to meet the needs of aparticular application.

The NVDIMM controller 116 on the volatile memory card 112 can beconfigured to monitor PE cycles, or other endurance-related parametersof non-volatile memory chips 104. The NVDIMM controller 116 can also beconfigured to transfer data across the non-volatile memory bus 106, toand from the non-volatile memory chips 104, and to transfer data acrossthe volatile memory bus 118, to and from the volatile memory chips 114.The NVDIMM controller 116 may transfer data in response to commandsreceived across the bus 120 from a host system. In embodiments, theNVDIMM controller 116 can be electrically connected to the host systemthrough the bus 120, in conjunction with the memory card contact pads122, and the memory card connector 130, view 180.

NVDIMM 101 can be designed to function when inserted into an industrystandard memory module socket such as a DDR3 or DDR4 socket. Thenon-volatile memory bus 106, volatile memory bus 118 and bus 120 mayinclude address, command/control and data signal groups, consistent withsignal groups found in industry standard memory buses such as DDR3 andDDR4 buses. Memory card contact pads 122 can have an industry standardfootprint and/or pattern, on one or both sides of volatile memory card112.

View 140 is consistent with view 100 and depicts NVDIMM 101 with aremovable non-volatile memory card 102 disassembled from volatile memorycard 112. According to embodiments, an installed non-volatile memorycard 102 can be replaced with a replacement non-volatile memory card, asthe installed non-volatile memory card 102 approaches or exceeds anendurance limit, after which the non-volatile memory card 102 may becomeunreliable for data storage.

Non-volatile memory card 102 can be designed with a set of non-volatilememory card contact pads 124, which provide electrical contacts forinterfacing the card 102 with volatile memory card 112, throughnon-volatile memory card connector 108.

Non-volatile memory card 102 may also be designed to have uniquemechanical keying features to prevent insertion of other types of memorycards into non-volatile memory card connector 108. View 140 depictslatches 110 in released positions, which can allow non-volatile memorycard 102 to be removed and replaced.

View 180, consistent with views 100 and 140, depicts a non-volatilememory card 102 assembled to volatile memory card 112, and the volatilememory card 112 assembled, through insertion into memory card connector130, to a motherboard 138 of a host system. In embodiments, memory cardconnector 130 can be an industry standard memory card connector such asa DDR3 connector or a DDR4 connector.

Memory card connector 130 includes latches 126, which can be used tosecure volatile memory card 112 within memory card connector 130, whenin a latched position, and to release volatile memory card 112 frommemory card connector 130, when in a released position. The operation oflatches 126 is consistent with the operation of latches 110, as depictedin views 100 and 140.

FIG. 1 depicts a single NVDIMM 101 assembled to a motherboard 138,however in some embodiments, a plurality of NVDIMMs 101 assembled tomotherboard 138 may be possible. For example, in some embodiments, amotherboard 138 or PCB in an electronic system may be populated withfour NVDIMM modules.

Supercapacitor 128 may be a single capacitor or multiple capacitors,connected in parallel, located within the host system. Supercapacitor128 is an independent power source that can provide the NVDIMM 101 withpower during a system power failure, system shutdown or other powerinterruption event. The consistent power provided by supercapacitor 128can be useful for powering the NVDIMM controller 116 for a durationsufficient to transfer data stored in the volatile memory chips 114 tothe non-volatile memory chips 104. Such a data transfer can protectcritical data stored in the volatile memory chips 114 from corruption orloss.

A supercapacitor, also referred to as an “ultracapacitor”, is ahigh-capacity electrochemical capacitor that can store between 10 and100 times more energy per unit volume than an electrolytic capacitor,can receive and deliver charge much faster than conventional batteries,and can tolerate more charge and discharge cycles than rechargeablebatteries.

Volatile memory card 112 includes a light-emitting diode (LED) 132,electrically coupled to the NVDIMM controller 116. The NVDIMM controller116, in response to an endurance parameter value of non-volatile memorychips 104 exceeding a warning and/or replacement threshold value, canissue an alert to the host system and/or illuminate the LED 132. In someembodiments, the LED 132 can emit multiple colors of light, for example,red, yellow and green. Operation of such multicolor LEDs can be usefulto indicate the number of PE cycles the NVDIMM 101 has experienced. Forexample the LED 132 can emit green light to indicate that the number ofPE cycles of the NVDIMM 101 are below a warning endurance thresholdvalue, and that the NVDIMM 101 is fully operational with minimal risk ofdata loss. Similarly, the LED 132 can emit yellow light to indicate thatthe number of PE cycles of the NVDIMM 101 is between the warning and areplacement endurance threshold value, and that the NVDIMM 101 isneeding replacement soon in order to avoid data loss. The LED 132 canemit red light to indicate that the number of PE cycles are above thereplacement endurance threshold value, and that the NVDIMM 101 requiresimmediate replacement in order to avoid data loss.

According to embodiments the LED 132 may be optically coupled to a lightpipe 134, which can be used to transmit light from the volatile memorycard 112, through an equipment panel 136, to an exterior surface of thehost system, where it can be viewed by an individual responsible forreplacing the non-volatile memory card 102. According to embodiments,the light pipe 134 may be constructed from any opticallytransparent/transmissive materials including, but not limited to,Lexan™, fused silica, clear polycarbonates, optically transparentpolymers and optical grade acrylics.

FIG. 2 includes a block diagram 200 depicting a computing systemincluding NVDIMMs 101A, 101B, 101C and 101D with replaceablenon-volatile memory cards 102A, 102B, 102C and 102D, respectively,according to embodiments consistent with the figures.

NVDIMM 101A includes non-volatile memory card 102A with non-volatilememory chips 104 connected to non-volatile memory bus 106. Non-volatilememory bus 106 is electrically connected to volatile memory card 112Athrough non-volatile memory card connector 108. Volatile memory card112A includes volatile memory chips 114, NVDIMM controller 116 andvolatile memory bus 118, consistent with FIG. 1.

FIG. 2 also depicts NVDIMMs 101B, 101C and 101D, including non-volatilememory cards 102B, 102C and 102D, coupled to volatile memory cards 112B,112C and 112D, respectively. According to embodiments, NVDIMMs 101B,101C and 101D are consistent with NVDIMM 101A. In some embodiments, ahost system such as 237 may include a single NVDIMM, e.g., 101A, fourNVDIMMs, as depicted in FIG. 2, or another number of NVDIMMs suitable tomeet the data storage, accessibility and bandwidth needs of theparticular host system. According to embodiments, NVDIMMs 101A, 101B,101C and 101D can be installed in industry standard sockets, e.g.,memory card connector 130, that are attached to a motherboard or otherPCB.

In some embodiments, a memory buffer 202 may be interconnected betweenthe NVDIMMs, e.g., 101A, 101B, 101C and 101D, and a memory controller204, and may be useful for buffering data, command and control signalssent to the NVDIMMs. In some embodiments, the logic and/or circuitfunctions included in memory buffer 202 may be included within memorycontroller 204 and/or processor 206. According to embodiments, thefunction of memory controller 204 can be consistent with memorycontrollers used to access industry standard memory modules such as DDR3and DDR4 modules. In embodiments, processor 206 can be a singleprocessor chip or a cluster of interconnected processor chips,consistent with processors found in personal computers, servers,high-performance computers (HPCs) or other computing device(s) and/orsystem(s). In some embodiments, the functions of processor 206 andmemory controller 204 may be integrated into a single chip and/orelectronic module, and in some embodiments, the functions of processor206 and memory controller 204 may be distributed among multiple chipsand/or electronic modules.

The processor 206, in conjunction with memory controller 204, mayinitiate memory transactions involving data read and write operations toand from NVDIMMs 101A, 101B, 101C and 101D. The NVDIMMs may be useful inproviding high-bandwidth, low latency, secure data storage for dataaccessed and processed by processor 206 of host system 237.

In some embodiments, the memory capacity of the non-volatile memorychips 104 of non-volatile memory card 102A can be greater than thememory capacity of the volatile memory chips 114 of volatile memory card112A. In such embodiments, the volatile memory card 112A can act as awrite buffer for the non-volatile memory card 102A, where data writtento the volatile memory card 112A is copied, at a later time, to thenon-volatile memory card 102A. In some embodiments, the volatile memorycard 112A and the non-volatile memory card 102A can have the same memorycapacity. In general, the volatile memory chips 114 can receive datawritten to them at a higher rate then can the non-volatile memory chips.This higher data write speed may be useful in buffering data writeactivity to the NVDIMM 101A and can result in a higher bandwidth memorymodule than is achievable by using only non-volatile memory chips 104.

According to embodiments, NVDIMMs, e.g., 101A, can be operated in eitheran “access through mode” or a “halted mode” during anupgrade/replacement of non-volatile memory card 102A. When NVDIMMs areoperated in an access through mode during the upgrade operation, hostsystem 237 is allowed to access data stored in the NVDIMMs, 101A, 101B,101C and 101D. Such access involves, during a read operation, the NVDIMMcontroller 116 retrieving the data stored in the NVDIMMs from copy(s)located on the volatile memory card(s) 102A, 102B, 102C and 102D. Inaddition to retrieving the data, NVDIMM controller 116 may alsodecompress the data before sending it over bus 120 to memory controller204. Similarly, during a write operation, in access through mode, theNVDIMM controller 116 may also compress the data received from memorycontroller 204, before writing it to the volatile memory card(s), e.g.,112A. Although data stored in the NVDIMMs would still be accessibleduring access through mode, the operations of data compression anddecompression would add additional latency to any read or writeoperations.

When NVDIMMs are operated in halted mode during the upgrade operation,host system 237 would not be allowed to access data stored in theNVDIMMs, 101A, 101B, 101C and 101D. Access to data on the NVDIMMs wouldresume following the completion of the replacement of installednon-volatile memory card 102.

FIG. 3 is a flow diagram 300 illustrating a method for backing up andreplacing an installed non-volatile memory card of a non-volatile dualin-line memory module (NVDIMM), according to embodiments. The process300 moves from start 302 to operation 304.

Operation 304 generally refers to monitoring an endurance parametervalue of a first, installed and operational, non-volatile memory card ofan NVDIMM. According to embodiments, an endurance parameter value may bemonitored by an NVDIMM memory controller.

The endurance parameter value can be useful as a metric of the generalreliability of a non-volatile memory card and/or chips of an NVDIMM.According to embodiments, an endurance parameter value may take onseveral forms. For example, in some embodiments, the endurance parametervalue can be a count of PE cycles experienced by an installednon-volatile memory card. The number of PE cycles that a non-volatilememory chip or card can experience before it becomes unreliable can bemodeled, measured and correlated to empirical non-volatile memoryfailure results. Such modeling, measurement and correlation activity maybe useful to determine “safe” endurance threshold values that can beused to predict when a non-volatile memory chip or module will begin toperform unreliably.

In some embodiments, the endurance parameter value may indicate anon-volatile memory die or package failure, such as a cyclic redundancycheck (CRC) error produced by a memory controller or processor circuit.A CRC error can result from a non-volatile memory chip or moduleproducing data, through a read operation, that differs from datapreviously written into it. Other types of memory failure indicators,such as those generated by bit error rate (BER) detection, may also beuseful as endurance parameters. Once the endurance parameter value hasbeen monitored, the process 300 moves to operation 308.

At operation 308, the endurance parameter value is compared againstknown endurance threshold values, and a decision is made based upon theendurance parameter value. According to embodiments, a warning endurancethreshold value may be used to indicate that an installed non-volatilememory card has experienced sufficient usage, e.g., PE cycles, towarrant its upcoming replacement. The calculation of the warningendurance threshold value may take into account an estimated time for aservice technician to respond to a notification that the warningendurance threshold has been reached, and to replace the installednon-volatile memory card.

A replacement endurance threshold, higher than the warning endurancethreshold, may be used to indicate that an installed non-volatile memorycard has experienced sufficient usage, e.g., PE cycles, to warrant itsimmediate replacement. By way of example, a “critical” number of PEcycles of an NVDIMM may be determined, through calculation or modeling,to correlate to a particular unacceptable failure rate for the NVDIMM.The warning endurance threshold value may be set, for example, to avalue that is 80% of the critical number of PE cycles, and thereplacement endurance threshold value may be set, for example, at 95% ofthe critical number.

According to embodiments, the comparing and decision-making operationsdescribed above may be performed by the NVDIMM memory controller. Thewarning and replacement endurance thresholds can be programmed into theNVDIMM memory controller, and in some embodiments additional endurancethresholds or monitored NVDIMM conditions may be used in the decisionprocess described above. In some embodiments, the warning andreplacement endurance threshold values can be modified by the hostsystem, e.g., 237, FIG. 2.

If the endurance parameter value is less than or equal to the warningendurance threshold value, the process 300 returns to operation 304,where endurance parameter monitoring continues. If the enduranceparameter value is greater than the warning endurance threshold valuebut less than or equal to the replacement endurance threshold value, theprocess moves to operation 306. If the endurance parameter value isgreater than the replacement endurance threshold, the process moves toupgrade process 310, starting with operation 312. The upgrade process310 includes operations 312 through 326.

Operation 306 generally refers to generating a system alert. Accordingto embodiments, a system alert includes generating a notification to ahost system indicating the endurance parameter of the installednon-volatile memory card has exceeded the warning endurance threshold.The system alert may include a text message sent to a systemadministrator or service technician, an entry into a service log, orother type of message, sent to a host system, and intended to initiatethe replacement of an installed non-volatile memory card of a particularNVDIMM. In some embodiments, the system alert can include illuminatingan LED to a particular color, e.g., yellow, to indicate the need forreplacement of the installed non-volatile memory card of the particularNVDIMM. Once the system alert has been generated, the process moves tooperation 304, where endurance parameter monitoring continues.

Operation 312 generally refers to halting of read/write transactions oractivity between the NVDIMM and a host system. In some embodiments, amemory controller, e.g., 204, FIG. 2, of a host system, may halt anyfuture read or write transactions to the particular NVDIMM having anon-volatile memory card in need of replacement. Halting of futurememory transactions can correspond to the NVDIMM being placed in a“halted mode”, and is an optional operation in the upgrade process 310.Halting of read/write transactions involving the NVDIMM may be performedin scenarios where continuity of access to data stored in the NVDIMM isnot critical, and where rapid replacement of the installed non-volatilememory card is expected. Read/write transactions may not be halted ifthe NVDIMM is placed in an “access through” mode. Once the read/writetransactions or activity between the NVDIMM and a host system has beenhalted, the process moves to operation 314.

Operation 314 generally refers to compressing data stored in theinstalled non-volatile memory card. According to embodiments, an NVDIMMcontroller may apply a data compression algorithm to data stored in theinstalled non-volatile memory card. Data compression may be useful toreduce the amount of memory capacity needed to store the data, in thecase where the storage area consumed by the uncompressed data in theinstalled non-volatile memory card is greater than the amount of memoryavailable in the volatile memory card of the NVDIMM. In cases wheresufficient memory capacity exists within the volatile card of the NVDIMMto hold the data contained in the installed non-volatile memory card,data compression may not be necessary. Once the data stored in theinstalled non-volatile memory is compressed, the process moves tooperation 316.

Operation 316 generally refers to copying the data stored in theinstalled non-volatile memory card to the volatile memory card. TheNVDIMM memory controller copies the data stored in the installednon-volatile memory card to the volatile memory card, following thecompression performed in operation 314. Creating a copy of the data inthe volatile memory card is useful for preserving it, and possiblyallowing access to it, while the installed non-volatile memory card ofthe NVDIMM is being replaced. Once the data stored in the installednon-volatile memory card is copied to the volatile memory card, theprocess moves to operation 318.

Operation 318 generally refers to enabling a visual indicator on theNVDIMM. According to embodiments, the visual indicator can be an LED orother light-producing device which can be used to indicate, to a servicetechnician, a particular NVDIMM having a non-volatile memory card inneed of replacement. The NVDIMM controller can be configured toilluminate the LED, in response to the endurance parameter valueexceeding the warning and/or replacement endurance threshold(s). In someembodiments the NVDIMM controller can flash or blink the LED, which can,in some embodiments, emit various colors of light corresponding to theendurance parameter value exceeding the warning endurance thresholdand/or the replacement endurance threshold. Once the visual indicator isenabled, the process moves to operation 320.

Operation 320 generally refers to replacing the installed non-volatilememory card with a replacement non-volatile memory card. According toembodiments, the installed non-volatile memory card is replaced inresponse to a visual indicator being enabled, and/or a system alertbeing received by a service technician. Replacing the installednon-volatile memory card is useful in providing the NVDIMM and the hostsystem with reliable non-volatile memory devices.

In response to the replacement of the installed non-volatile memory cardwith the replacement non-volatile memory card, the NVDIMM controller candetect, and communicate to the host system, the presence of thereplacement non-volatile memory card. Detection of the replacementnon-volatile memory card may be accomplished by the NVDIMM controllercomparing a unique ID (UID) of the replacement non-volatile memory cardagainst a UID of the original, installed non-volatile memory card. Insome embodiments, the replacement non-volatile memory card may bedetected by the host system, in response to a user service techniciannotifying the host system of the completed non-volatile memory cardreplacement. Once the installed non-volatile memory card is replaced,the process moves to operation 322.

Operation 322 generally refers to decompressing the data stored in thevolatile memory. According to embodiments, the NVDIMM controller canapply a decompression algorithm compatible with the compressionalgorithm applied in operation 314, to the data stored in the volatilememory card of the NVDIMM. Decompressing the data may be useful inproviding a copy of the data to the non-volatile memory card that iseasily accessed and used by the host system. Once the data stored in thevolatile memory card is decompressed, the process moves to operation324.

Operation 324 generally refers to copying the data stored in thevolatile memory card to the replacement non-volatile memory card.According to embodiments, the NVDIMM controller copies the data storedin the volatile memory card of the NVDIMM to the replacementnon-volatile memory card. The copying is performed in response todetection, either by the NVDIMM controller, or by the host system, thatthe originally installed non-volatile memory card has been replaced.This copying is useful in providing a persistent, secure copy of thedata for use by the host system. Once the data stored in the volatilememory card is copied to the replacement non-volatile memory card, theprocess moves to operation 326.

Operation 326 generally refers to resuming read/write transactions oractivity between the NVDIMM and the host system. The operation ofresuming read/write transactions between the NVDIMM and host system isperformed in response to the halting of such transactions performed inoperation 312. According to embodiments, the host system initiates theresuming of transactions in response to the completion of operation 324,described above. Resuming read/write transactions allows the NVDIMM tobe freely accessed by the host system, and resume its normal function ofproviding data storage to the host system. Once read/write transactionsbetween the NVDIMM and the host system have resumed, the process returnsto operation 304, where endurance parameter monitoring continues.

The present disclosure may be a system, a method, and/or a computerprogram product. The computer program product may include a computerreadable storage medium (or media) having computer readable programinstructions thereon for causing a processor to carry out aspects of thepresent disclosure.

The computer readable storage medium can be a tangible device that canretain and store instructions for use by an instruction executiondevice. The computer readable storage medium may be, for example, but isnot limited to, an electronic storage device, a magnetic storage device,an optical storage device, an electromagnetic storage device, asemiconductor storage device, or any suitable combination of theforegoing. A non-exhaustive list of more specific examples of thecomputer readable storage medium includes the following: a portablecomputer diskette, a hard disk, a random-access memory (RAM), aread-only memory (ROM), an erasable programmable read-only memory (EPROMor Flash memory), a static random-access memory (SRAM), a portablecompact disc read-only memory (CD-ROM), a digital versatile disk (DVD),a memory stick, a floppy disk, a mechanically encoded device such aspunch-cards or raised structures in a groove having instructionsrecorded thereon, and any suitable combination of the foregoing. Acomputer readable storage medium, as used herein, is not to be construedas being transitory signals per se, such as radio waves or other freelypropagating electromagnetic waves, electromagnetic waves propagatingthrough a waveguide or other transmission media (e.g., light pulsespassing through a fiber-optic cable), or electrical signals transmittedthrough a wire.

Computer readable program instructions described herein can bedownloaded to respective computing/processing devices from a computerreadable storage medium or to an external computer or external storagedevice via a network, for example, the Internet, a local area network, awide area network and/or a wireless network. The network may comprisecopper transmission cables, optical transmission fibers, wirelesstransmission, routers, firewalls, switches, gateway computers and/oredge servers. A network adapter card or network interface in eachcomputing/processing device receives computer readable programinstructions from the network and forwards the computer readable programinstructions for storage in a computer readable storage medium withinthe respective computing/processing device.

Computer readable program instructions for carrying out operations ofthe present disclosure may be assembler instructions,instruction-set-architecture (ISA) instructions, machine instructions,machine dependent instructions, microcode, firmware instructions,state-setting data, or either source code or object code written in anycombination of at least one programming languages, including an objectoriented programming language such as Smalltalk, C++ or the like, andconventional procedural programming languages, such as the “C”programming language or similar programming languages. The computerreadable program instructions may execute entirely on the user'scomputer, partly on the user's computer, as a stand-alone softwarepackage, partly on the user's computer and partly on a remote computeror entirely on the remote computer or server. In the latter scenario,the remote computer may be connected to the user's computer through anytype of network, including a local area network (LAN) or a wide areanetwork (WAN), or the connection may be made to an external computer(for example, through the Internet using an Internet Service Provider).In some embodiments, electronic circuitry including, for example,programmable logic circuitry, field-programmable gate arrays (FPGA), orprogrammable logic arrays (PLA) may execute the computer readableprogram instructions by utilizing state information of the computerreadable program instructions to personalize the electronic circuitry,in order to perform aspects of the present disclosure.

Aspects of the present disclosure are described herein with reference toflowchart illustrations and/or block diagrams of methods, apparatus(systems), and computer program products according to embodiments of theinvention. It will be understood that each block of the flowchartillustrations and/or block diagrams, and combinations of blocks in theflowchart illustrations and/or block diagrams, can be implemented bycomputer readable program instructions.

These computer readable program instructions may be provided to aprocessor of a general purpose computer, special purpose computer, orother programmable data processing apparatus to produce a machine, suchthat the instructions, which execute via the processor of the computeror other programmable data processing apparatus, create means forimplementing the functions/acts specified in the flowchart and/or blockdiagram block or blocks. These computer readable program instructionsmay also be stored in a computer readable storage medium that can directa computer, a programmable data processing apparatus, and/or otherdevices to function in a particular manner, such that the computerreadable storage medium having instructions stored therein comprises anarticle of manufacture including instructions which implement aspects ofthe function/act specified in the flowchart and/or block diagram blockor blocks.

The computer readable program instructions may also be loaded onto acomputer, other programmable data processing apparatus, or other deviceto cause a series of operational operations to be performed on thecomputer, other programmable apparatus or other device to produce acomputer implemented process, such that the instructions which executeon the computer, other programmable apparatus, or other device implementthe functions/acts specified in the flowchart and/or block diagram blockor blocks.

The flowchart and block diagrams in the Figures illustrate thearchitecture, functionality, and operation of possible implementationsof systems, methods, and computer program products according to variousembodiments of the present disclosure. In this regard, each block in theflowchart or block diagrams may represent a module, segment, or portionof instructions, which comprises at least one executable instructionsfor implementing the specified logical function(s). In some alternativeimplementations, the functions noted in the block may occur out of theorder noted in the figures. For example, two blocks shown in successionmay, in fact, be executed substantially concurrently, or the blocks maysometimes be executed in the reverse order, depending upon thefunctionality involved. It will also be noted that each block of theblock diagrams and/or flowchart illustration, and combinations of blocksin the block diagrams and/or flowchart illustration, can be implementedby special purpose hardware-based systems that perform the specifiedfunctions or acts or carry out combinations of special purpose hardwareand computer instructions.

The descriptions of the various embodiments of the present disclosurehave been presented for purposes of illustration, but are not intendedto be exhaustive or limited to the embodiments disclosed. Manymodifications and variations will be apparent to those of ordinary skillin the art without departing from the scope and spirit of the describedembodiments. The terminology used herein was chosen to explain theprinciples of the embodiments, the practical application or technicalimprovement over technologies found in the marketplace, or to enableothers of ordinary skill in the art to understand the embodimentsdisclosed herein.

What is claimed is:
 1. A system comprising: a memory; and a processor incommunication with the memory, the processor configured to obtaininstructions from the memory that cause the processor to perform amethod comprising: monitoring an endurance parameter value of a firstnon-volatile memory of a non-volatile dual in-line memory module(NVDIMM) located within a host system, the endurance parameter valuebeing a count of program-erase (P/E) cycles applied to the firstnon-volatile memory; illuminating, to a green color, in response to theendurance parameter value not exceeding a warning threshold, alight-emitting diode (LED) mounted on a volatile memory card of theNVDIMM, the LED coupled to a light pipe configured to transmit lightfrom the LED through an equipment panel to an exterior surface of thehost system, whereby the light from the LED is viewable by an individualresponsible for replacing the first non-volatile memory, the green colorindicating the endurance parameter value of the first non-volatilememory has not exceeded the warning threshold; illuminating, in responseto the endurance parameter value exceeding a warning threshold, the LEDto a yellow color, the yellow color indicating the endurance parametervalue of the first non-volatile memory has exceeded the warningthreshold; and initiating, in response to the endurance parameter valueexceeding a replacement threshold greater than the warning threshold, anupgrade process, the upgrade process including copying data from thefirst non-volatile memory to the volatile memory card of the NVDIMM, theupgrade process further including copying, in response to the firstnon-volatile memory being replaced with a second non-volatile memory,the data from the volatile memory to the second non-volatile memory, theupgrade process further including illuminating the LED a red color, thered color indicating the endurance parameter value of the firstnon-volatile memory has exceeded the replacement threshold.